Power Interconnection Design Considerations For High Current Connectors

1. Space issues:

First of all, it is necessary to determine how much space is required for the power interconnection of high current connectors and how much available space is allocated in the finished product design. Although saving space is the primary task of most OEMs, the height, width and length of connectors, especially their copper content, will directly affect the achievable current density and require more power in the same space, which is a challenge for connector manufacturers.

2. Power integrity:

Connector manufacturers continue to develop innovative designs that require higher conductivity materials and more creative use of space to improve power transmission and electrical performance without expanding space requirements. For example, in some cases, a high current connector with a lower profile may be preferred to maximize the air flow for cooling. However, in other cases, a connector that provides higher contact performance may be the correct solution to correctly deal with the amount of current generated in a smaller card edge space, and achieve the best balance between the power supply power and its thermal effect in the PCB and the space design requirements, so as to ensure the safety performance of the final product.

3. Thermal management:

Thermal problems caused by high current connector contact force, shrinkage resistance and inefficient air flow are always a problem and should be carefully considered early in the design process. PCB copper content is one of the factors. Too little copper will limit the current flow and lead to shrinkage resistance. The appropriate copper wiring size can reduce the body resistance, so as to reduce the temperature and reduce the loss, otherwise the heat may be emitted to the connector interface, so as to reduce the reliability problem.

4. Operational safety:

Considering the operational safety of high current connectors, designers need to consider the whole equipment system and its power supply architecture to understand the potential of shrinkage areas and voltage drops that may affect thermal and electrical performance from beginning to end. Because the maximum voltage drop defines the thermal stability threshold of the power supply contact, once this threshold is exceeded, the possibility of thermal instability will increase significantly.

5. Electrical performance test:

Connector manufacturers traditionally determine the current rating according to the electrical performance of their products under ideal conditions, and take into account various conditions and interactions that will affect the actual operating environment of the connector to ensure that the power integrity in the interconnection design of high current connectors meets the application requirements.